Thin Wall Packaging Molds are developed through innovations in hot runner and mold base technology, giving StackTeck its reputation for delivering fast cycling, high output tooling solutions.
Food packaging and thin wall packaging molding demand fast cycles with extremely aggressive L/T ratio’s up to 300 to 1 L/T for conventional part designs and up to 550 L/T for specialty ultra thin wall . StackTeck container and lid molds are robust, accurate and are used in a wide variety of applications globally.
StackTeck’s benchmark solutions for Thinwall Packaging:
- Single-face Molds
- Stack Molds
- Quick Product Change (QPC)
- Mold Programs
- System Integration
- Part Design