In the 1990’s, StackTeck started building turnkey In-Mold Labeling (IML) systems the hard way, with a designed-from-scratch mechanical robot to insert the labels. As project volumes increased, it quickly became apparent that collaboration would be needed with a leading IML robotics supplier to ensure optimal productivity with a quick production startup. Such collaborations led to […]
StackTeck Systems Limited started building In-Mold Labeling (IML) molds in the 1990s, typically with just 2 or 4 cavities in a single face mold. As the market for IML products developed, many applications required higher productivity. This led to the adoption of stack molds to run IML parts, using specialized mold and robotics innovations. In the […]
Technology Presentation: “Advanced In-mold Labeling (IML) Systems Technology to Minimize Cost”. First presented at the AMI Thinwall Packaging 2015 Conference, by Jordan Robertson of StackTeck Inc. Key topics include the part cost savings and reliability of high-cavitation IML container molding systems, including stack molds and simplified robot systems, made possible by custom hot runner solutions for IML stack molds, and the additional part cost savings via Ultra-thin TRIM (Thin Recess Injection Molding) molding technology
Technology Presentation: “In-Mold Labeling Decoration for TRIM™ Ultra-Thinwall Packaging”. First presented at the IMLCON 2014, by Jordan Robertson of StackTeck Inc. Key topics includes a technology review of patent-pending TRIM™ (Thin Recess Injection Molding) process, and the associated cost benefits. Includes multiple production examples of TRIM™ in combination with In-Mold Labeling (IML) solutions.