Brampton, Ontario, Canada: StackTeck Systems Ltd., announces its enhanced TRIM (Thin Recess Injection Molding) technology for ultra-lightweight packaging applied to single-serve applications.
TRIM technology applied now to single-serve applications allows downstream printing in an area that can cover 75% of the part’s sidewalls which translates into the lowest possible cost injection molding option.
A 4 cavity TRIM mold for a 200 mL round IML cup will be running in the Ilsemann booth A-56 in Hall 10 in a high performance Arburg machine.
“With the use of this enhanced TRIM Technology, we are able to mold a cup that has ultra-thin panels of .008” (0.2 mm) thickness, offering the lowest possible cost with printable capabilities, while keeping IML as an option for this type of application,” said Jordan Robertson, General Manager, Business Development and Marketing.
It has been demonstrated that with the use of TRIM technology, conventional lightweight parts with an L/T (ratio of length to average thickness) up to 300, can be made thinner with additional light-weighting of 30-40% by weight.
Downstream Printing Now Feasible:
- Print area can cover 75% of sidewall
- Lowest possible cost IM cup
- 20% lighter than conventional IM
IML Remains an Option:
- 100% wrap around coverage
- Smooth cavity for label
- Color contrast between label and part
- 20% lighter than conventional IM-IML