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YOU ARE HERE: Home / News / StackTeck Announces the First Ever Use of Ultra-Thin TRIM Technology for Single Serve Cups  

StackTeck Announces the First Ever Use of Ultra-Thin TRIM Technology for Single Serve Cups  

October 13, 2016

Brampton, Ontario, Canada: StackTeck Systems Ltd., announces its enhanced TRIM (Thin Recess Injection Molding) technology for ultra-lightweight packaging applied to single-serve applications.

TRIM technology applied now to single-serve applications allows downstream printing in an area that can cover 75% of the part’s sidewalls which translates into the lowest possible cost injection molding option.

A 4 cavity TRIM mold for a 200 mL round IML cup will be running in the Ilsemann booth A-56 in Hall 10 in a high performance Arburg machine.

“With the use of this enhanced TRIM Technology, we are able to mold a cup that has ultra-thin panels of .008” (0.2 mm) thickness, offering the lowest possible cost with printable capabilities, while keeping IML as an option for this type of application,” said Jordan Robertson, General Manager, Business Development and Marketing.

It has been demonstrated that with the use of TRIM technology, conventional lightweight parts with an L/T (ratio of length to average thickness) up to 300, can be made thinner with additional light-weighting of 30-40% by weight.

Injection Mold detail | Ultra-Thin TRIM Technology for Single Serve Cups | StackTeck

        Downstream Printing Now Feasible:  

  • Print area can cover 75% of sidewall
  • Lowest possible cost IM cup
  • 20% lighter than conventional IM

 

 

 

IML Remains an Option:

  • 100% wrap around coverage
  • Smooth cavity for label
  • Color contrast between label and partInjection Molded Part | Ultra-Thin TRIM Technology for Single Serve Cups - IML | Molded on StackTeck Mold
  • 20% lighter than conventional IM-IML

 

 

 

 

 

 

Injection Molded Part | Ultra-Thin TRIM Technology for Single Serve Cups | Molded on StackTeck Mold
SONY DSC

 

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Filed Under: News, Technology Trends

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