Presentation Title:
“In-Mold Labeling Decoration for TRIM™ Ultra-Thinwall Packaging”. First presented at the IMLCON 2014, by Jordan Robertson of StackTeck Systems Limited.
Key Topics:
- Technology review of patent-pending TRIM™ (Thin Recess Injection Molding) process
- Types of injection molded thinwall packaging most suitable for TRIM™ ultra-thinwalling
- Combining TRIM with In-Mold Labeling (IML) solutions
Highlights:
- Examples of various TRIM™ implementations, with part weight savings up to and over 40%
- Innovative examples of TRIM™ containers, including round and square containers with tamper-resistant features, and In-Mold Labeling solutions including the 2009 IMDA IML award winner.
For more Information on In-Mold Labeling Systems Technology:
- Email StackTeck
- Contact Jordan Robertson: +1 (416) 749-1698 x334
